DMI$500751$ - translation to spanish
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DMI$500751$ - translation to spanish

COMPUTER BUS USED BY INTEL FOR CONNECTING THE NORTHBRIDGE AND SOUTHBRIDGE ON A COMPUTER MOTHERBOARD
SERR DMI; SERR; DMI 2.0; DMI 3.0; Enterprise Southbridge Interface

DMI      
Interfase para la dirección de ordenadores de mesa, estándar que permite la interfase entre los diferentes sistemas de hardware y software de los ordenadores personales

Wikipedia

Direct Media Interface

In computing, Direct Media Interface (DMI) is Intel's proprietary link between the northbridge and southbridge on a computer motherboard. It was first used between the 9xx chipsets and the ICH6, released in 2004. Previous Intel chipsets had used the Intel Hub Architecture to perform the same function, and server chipsets use a similar interface called Enterprise Southbridge Interface (ESI). While the "DMI" name dates back to ICH6, Intel mandates specific combinations of compatible devices, so the presence of a DMI interface does not guarantee by itself that a particular northbridge–southbridge combination is allowed.

DMI shares many characteristics with PCI Express, using multiple lanes and differential signaling to form a point-to-point link. Most implementations use a ×4 link, while some mobile systems (e.g. 915GMS, 945GMS/GSE/GU and the Atom N450) use a ×2 link, halving the bandwidth. The original implementation provides 10 Gbit/s (1 GB/s) in each direction using a ×4 link.

DMI 2.0, introduced in 2011, doubles the data transfer rate to 2 GB/s with a ×4 link. It is used to link an Intel CPU with the Intel Platform Controller Hub (PCH), which supersedes the historic implementation of a separate northbridge and southbridge.: 14 

DMI 3.0, released in August 2015, allows the 8 GT/s transfer rate per lane, for a total of four lanes and 3.93 GB/s for the CPU–PCH link. It is used by two-chip variants of the Intel Skylake microprocessors, which are used in conjunction with Intel 100 Series chipsets; some low power (Skylake-U onwards) and ultra low power (Skylake-Y onwards) mobile Intel processors have the PCH integrated into the physical package as a separate die, referred to as OPI (On Package DMI interconnect Interface) and effectively following the system on a chip (SoC) design layout. On 9 March 2015, Intel announced the Broadwell-based Xeon D as its first enterprise platform to fully incorporate the PCH in an SoC configuration.

In 2021, with the release of 500 series chipsets, Intel increased the amount of DMI 3.0 lanes from four to eight, doubling the bandwidth.

DMI 4.0, released on November 4, 2021 with 600 series chipsets, doubles the bandwidth each lane provides and is two times faster when compared to DMI 3.0. The number of DMI 4.0 lanes depends on chipset model used.